Temp
erature Cycling Reliability of Electronic Assemblies
Content
Status: August 2002
Content
Disclaimer & usage
Introduction
Fatigue related fails of solder joints
The Coffin-Manson model
Phenomena with constant decay probability
Model for solder joint fatigue through temperature variations
Data fitting with the solder joint fatigue model
Example of a reliability evaluation
Solder joint - solder joint benchmarking
Soldered part - soldered part benchmarking
Front side - back side benchmarking
Assembly - assembly benchmarking
Experiments with one temperature swing
Split experiments with several temperature swings
Confidence intervals
Extrapolation to usage conditions
Assemblies of units with equal fail probabilities
Assemblies of units with different fail probabilities
Summary